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Electrochemical Analysis of Additives in Copper Electroplating Bath Using Diamond Electrode

机译：金刚石电极铜电镀浴中添加剂的电化学分析

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Tomoko NISHITANI; Akihiro KAWAGUCHI; Hideo HONMA;
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年度 2010
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1. The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses. II. Copper electroplates from sulfate baths [J] . Yu. Vegis, L. Simanavichyus Protection of Metals . 1999,第2期

机译：电镀液在溶液中的电化学行为，用于电量分析法确定其厚度。二。硫酸盐浴镀铜
2. The Electrochemical Behavior of Electroplates in Solutions for Coulometric Determination of Their Thicknesses.Ⅱ. Copper Electroplates from Sulfatic Baths [J] . Yu. Vegis, L. Simanavichus Protection of Metals . 1999,第2期

机译：库仑法测定其厚度的溶液中电化学行为。Ⅱ。硫酸盐浴镀铜
3. The electrochemical behavior of electroplates in solutions for coulometric determination of their thicknesses II. copper electroplates from sulfatic baths [J] . Yu. Vegis, L. Simanavichus Защита Металлов . 1999,第2期

机译：库仑法确定厚度的溶液中电镀液的电化学行为II。硫酸盐浴镀铜
4. ELECTROCHEMICAL DESTRUCTION OF ORGANIC ADDITIVES AT BORON DOPED DIAMOND ELECTRODES WITH SIMULTANEOUS RECOVERY OF METALS FROM ELECTROPLATING EFFLUENTS [C] . G. Lissens, M. Verhaege, E. Wettinck, 2003 TMS Annual Meeting, Mar 2-6, 2003, San Diego, California . 2003

机译：电化学降解硼掺杂金刚石电极上的有机添加剂，同时从电镀废水中回收金属
5. Microscopic and spectroscopic investigation of: I. Copper-additive systems in electroplating bath. II. Supported phospholipid bilayer systems. [D] . Feng, Zengqi Vivian. 2005

机译：显微镜和光谱学研究：I.电镀液中的铜添加剂系统。二。支持的磷脂双层系统。
6. Electroplating and magnetostructural characterization of multisegmented Co54Ni46/Co85Ni15 nanowires from single electrochemical bath in anodic alumina templates [O] . Victor M Prida, Javier García, Lucia Iglesias, 2013

机译：阳极氧化铝模板中来自单个电化学浴的多段Co54Ni46 / Co85Ni15纳米线的电镀和磁结构表征
7. CEN Webinars - A Comparative Analysis of Semiconductor Electroplating Bath Additives by CVS and HPLC [O] . 2014

机译：C＆EN网络研讨会 - CVS和HPLC半导体电镀浴添加剂的比较分析
8. On-Line Monitoring of Inorganic Additives in Copper Electroplating Baths [R] . Borhani, K. J. 1982

机译：铜电镀液中无机添加剂的在线监测

Electrochemical Analysis of Additives in Copper Electroplating Bath Using Diamond Electrode

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