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Recycling of silicon kerfs from wafer sawing
Recycling of silicon kerfs from wafer sawing
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机译:从晶圆切割中回收硅切口
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摘要
There is provided a method of cutting a silicon ingot and recycling residual material, comprising the steps of:a) cutting a Si ingot using carbon-containing particles as abrasive material such that Si wafers and a residual material comprising Si kerfs and carbon-containing particles are obtained;b) purifying the residual material such that purified Si kerfs and carbon-containing particles are obtained; andc) adding the purified Si kerfs and carbon-containing particles to a reduction process producing Si,the method being characterized in that the carbon-containing particles added in step a) is contains less than 0.25 ppm (w/w) boron and less than 0.5 ppm (w/w) phosphorus.
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