首页>
外国专利>
RECYCLING OF SILICON SAWING SLURRIES USING THERMAL PLASMA FOR THE PRODUCTION OF INGOTS OR WAFERS
RECYCLING OF SILICON SAWING SLURRIES USING THERMAL PLASMA FOR THE PRODUCTION OF INGOTS OR WAFERS
展开▼
机译:使用热等离子体回收硅锯切浆以生产锭子或硅片
展开▼
页面导航
摘要
著录项
相似文献
摘要
A thermal plasma, advantageously inductive, is used to purify silicon from sawing slurries. For this purpose, a thermal plasma is generated; sawing slurries containing silicon are submitted to the thermal plasma, to form the silicon deposit on the substrate.
展开▼