POWER MODULE WITH STACKED FLIP-CHIP AND METHOD OF FABRICATING THE SAME POWER MODULE

摘要

The present invention provides a stacked power module and a fabricating method thereof which can reduce a total size of a power module by overcoming disadvantages of a power module structure using conventional wire bonding, and can improve operating characteristics of a device based on the reduced size. The stacked power module comprises: a lead frame; a control device unit including a control device chip; a power device unit including a power device chip; and an interconnecting substrate, wherein the control device chip is arranged on the top of the interconnecting substrate in a flip chip bonding method, and the power device chip is arranged on the bottom of the interconnecting substrate in the flip chip bonding method. The power device chip is arranged between the interconnecting substrate and the lead frame, and is electrically connected to the lead frame through the bottom of the interconnecting substrate and inter-substrate solder balls between the interconnecting substrate and the lead frame. The lead frame includes a first part and a second part, wherein the first part is separated from the second part, and at least one power device chip is arranged at the first part and the second part each.