首页> 外文会议>IEEE MTT-S International Microwave Symposium >Ultra-compact G-band 16way power splitter/combiner module fabricated through a new method of 3D-copper additive manufacturing
【24h】

Ultra-compact G-band 16way power splitter/combiner module fabricated through a new method of 3D-copper additive manufacturing

机译:通过新的3D铜增材制造方法制造的超紧凑型G频段16路功率分配器/组合器模块

获取原文

摘要

A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then measured at 200-270 GHz using a WR4 test-through waveguide that traverses through the entire stack. The insertion loss measured at only 0.03 dB/mm showcasing its low loss characteristics. The 16 way splitter -combiner back to back was also tested using micro-machined WR4 through lines, fabricated and measured at an overall insertion loss of 4dB. The results highlight the success of the volumetric design in which a 16 way combiner measures <; 2dB insertion loss and occupies no more than 3.6 cm volume.
机译:定义了毫米波和亚毫米波组件的新设计和制造方法。通过在G频段频率范围内的完整3D体积16路分路器-合并器演示来描述3D铜添加剂制造过程。 WR4组合器通过设计压紧折叠,然后在其Z方向上切片,并制成切片以形成最终的23切片堆栈。然后,使用遍历整个堆栈的WR4测试直通波导在200-270 GHz下测量堆栈。仅在0.03 dB / mm处测得的插入损耗显示出其低损耗特性。还使用微加工的WR4直通线路测试了背对背16路分离器组合器,制造并测量的总插入损耗为4dB。结果突出表明了采用16路组合器测量<;的容积设计的成功。 2dB的插入损耗,占用的体积不超过3.6厘米。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号