CHEMICAL MECHANICAL POLISHING PAD WITH BROAD SPECTRUM, ENDPOINT DETECTION WINDOW AND METHOD OF POLISHING THEREWITH

摘要

The present invention provides a chemical mechanical polishing pad including a polishing layer having a polishing surface; and a broad spectrum endpoint detection window block having a preset thickness along an axis vertical to the polishing surface. The broad spectrum endpoint detection window block includes has a ring-type olefin addition polymer and represents uniform chemical composition across its thickness and the spectrum loss of 40% or less. The polishing surface provides a chemical mechanical polishing pad for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate.