首页> 外国专利> ASYMMETRIC CYCLIC DEPOSITION AND ETCH PROCESS FOR EPITAXIAL FORMATION MECHANISM OF SOURCE AND DRAIN REGIONS

ASYMMETRIC CYCLIC DEPOSITION AND ETCH PROCESS FOR EPITAXIAL FORMATION MECHANISM OF SOURCE AND DRAIN REGIONS

机译:源漏区表生形成机理的不对称循环沉积与蚀变过程

摘要

According to an embodiment of the present invention, a mechanism for forming source/drain (S/D) regions of field effect transistors (FETs) uses Cl_2 as an etchant during the epitaxial formation of the S/D regions. The mechanism includes the use of an asymmetric cyclic deposition and an etch (ACDE) process that form a preparation layer enabling epitaxial growth of the following epitaxial layer with transistor dopants. The mechanism also includes the soaking of the surface of a substrate with dopant-containing precursors in order to sufficiently include transistor dopants during the epitaxial growth of the S/D regions. By using Cl_2 as etchants, the mechanism also enables high throughput of the epitaxial growth of the S/D regions.;COPYRIGHT KIPO 2014
机译:根据本发明的实施例,在外延形成S / D区域期间,用于形成场效应晶体管(FET)的源/漏(S / D)区域的机制使用Cl_2作为蚀刻剂。该机制包括使用非对称循环沉积和蚀刻(ACDE)工艺,这些工艺形成了制备层,该制备层能够利用晶体管掺杂剂对随后的外延层进行外延生长。该机制还包括用含掺杂剂的前体浸泡衬底的表面,以便在S / D区域的外延生长期间充分包含晶体管掺杂剂。通过使用Cl_2作为蚀刻剂,该机理还可以实现S / D区域外延生长的高通量。; COPYRIGHT KIPO 2014

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号