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Selective Epitaxial Growth Of B-doped Sige And Hcl Etch Of Si For The Formation Of Sige:b Recessed Source And Drain (pmos Transistors)

机译:B掺杂Sige的选择性外延生长和Si的Hcl蚀刻以形成Sige:b凹陷的源极和漏极(pmos晶体管)

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摘要

HCl chemical vapor etching and selective epitaxial growth of B-doped SiGe layers for recessed source/drain application for pMOSFET structure have been presented. The pattern dependency of the etch and epitaxy process were studied and the data correlated to the Si coverage of the chip.
机译:提出了用于pMOSFET结构的源极/漏极嵌入式应用的HCl化学气相蚀刻和B掺杂SiGe层的选择性外延生长。研究了蚀刻和外延工艺的图案依赖性,并将数据与芯片的硅覆盖率相关。

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