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SUBMOUNT USED FOR LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE CHIP, AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE CHIP
SUBMOUNT USED FOR LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE CHIP, AND METHOD OF MANUFACTURING LIGHT EMITTING DIODE CHIP
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机译:用于发光二极管芯片的子座,发光二极管芯片以及制造发光二极管芯片的方法
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摘要
Disclosed are a sub-mount used for an LED, an LED chip, and a method of manufacturing the LED chip. According to an embodiment of the present invention, the sub-mount for LED includes: a substrate; and a bump which is formed on the upper part of the substrate and is coupled with to electrodes of the LED by a photolithography process, wherein the bump is provided in multiple layers reflecting light which is emitted by the LED.
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