Thin-film pattern forming apparatus, thin-film pattern forming method, and adjusting method of the apparatus

摘要

The present invention provides a film pattern forming apparatus, a film pattern forming method and an adjustment method for the thin film pattern forming apparatus. When unfavorable conditions such as the nozzle hole blockage are occurs, the apparatus in operation has to be stopped to replace the nozzle. So a technology which can reduce stop time in the operation of the apparatus is expected. The film pattern forming apparatus of the present invention, is provided with a nozzle unit with a plurality of nozzle holes which discharge droplets of the film materials, and the nozzle unit is arranged opposite to the substrate held in a loading station. The substrate is moved towards the direction of the surface of the substrate by a moving mechanism relative to the nozzle unit. A first image-capturing device detects a film pattern formed by coating the film materials on the substrate. A control device enables the droplets of the film materials to be discharged toward the substrate from the nozzle unit, and an inspection pattern is formed by the film material adhered to the substrate. Further, whether the nozzle holes of the nozzle unit are in good condition is determined by the acquisition and analysis of image data of the inspection pattern captured by using the first image-capturing device captured image data.