BONDING METHOD FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT AND THREE-DIMENSIONAL INTEGRATED CIRCUIT THEREOF

摘要

is the bonding method and the three-dimensional integrated circuit of a three-dimensional integrated circuit is disclosed according to the present invention . Matching method of a three-dimensional integrated circuit , comprising: providing a substrate , depositing a layer on the substrate , forming a graphic structure by irradiating light onto the layer, the cavity in a first phase to be deposited on the floor metal and forming a metal layer by co- depositing a second metal , the substrate in sequence , providing the first integrated circuit layer and the metal having a co- deposited layer , sequentially co- deposited metal layer , and the substrate layer the method comprising: providing a second integrated circuit having a , and by bonding the first integrated circuit at a predetermined temperature and the second integrated circuit includes forming a three-dimensional integrated circuit . ;