METAL LAYER STRUCTURE OF MULTILAYER FLEXIBLE BORAD AND MAKING METHOD THEREOF

摘要

The present invention relates to a metal structure and a manufacturing method of the flexible multi-layer substrate, of the flexible multi-layer substrate metal layer structure, comprising a first metal layer and a dielectric layer, the first metal layer includes a main body and one of the embedded base. The body is located in the upper portion of the embedded base, is larger than the footprint of the embedded base footprint of the body. After covering the body and the embedded base of the first metal layer, and a dielectric layer, to form a via hole to the position of the first metal, the second metal layer of the main body and the upper dielectric layer of the first metal layer is to be connected. Body and the embedded base is integrally molded, can be formed at the same time. Using a metal structure according to the present invention as a hole, or pads of a flexible multi-layer substrate, when it is used as a metal circuit, because the dielectric layer that is in contact with the metal layer is not easily delaminated or peeled off, and has a high reliability ;