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WITHIN-SEQUENCE METROLOGY BASED PROCESS TUNING FOR ADAPTIVE SELF-ALIGNED DOUBLE PATTERNING

机译:基于序列内测度的自适应自对准双图案工艺调整

摘要

Device and method is disclosed for that sort of restraint double patterning . The method includes the step of providing a substrate with a measuring unit adapted for etching processes and the processing platform configured to perform a deposition process and a vacuum within the critical dimension (CD) measurements . The vacuum within the CD measurements are utilized for a feed-forward control or feedback or feedforward suitable suitable control of the process parameters of the process sequence chamber processing platform . In one aspect , the first layer of the multilayer stack is masked and etched to form a template mask , in vacuo CD measurement of the template mask is made , the spacer adjacent to the template mask , forming a width which is dependent on the CD measurement of the template mask is . ;
机译:公开了用于那种约束双重图案的装置和方法。该方法包括以下步骤:为基板提供适合于蚀刻工艺的测量单元,以及配置成在临界尺寸(CD)测量内执行沉积工艺和真空的处理平台。 CD测量中的真空用于对过程序列室处理平台的过程参数进行前馈控制或反馈或前馈合适的适当控制。在一个方面,对多层堆叠的第一层进行掩膜和蚀刻以形成模板掩模,在真空中进行模板掩模的CD测量,与模板掩模相邻的间隔物,形成取决于CD测量的宽度。模板蒙版的。 ;

著录项

  • 公开/公告号KR101413661B1

    专利类型

  • 公开/公告日2014-07-01

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20117003283

  • 申请日2009-07-10

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 15:40:37

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