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Manufacturing method of electroconductive fabric for electromagnetic interference(EMI) shielding by using electroless

机译:一种化学屏蔽电磁干扰的导电织物的制造方法

摘要

The present invention relates to a plating method for applying conductivity to fibers, comprising: a preparation process (S10) for injecting a fiber material; a pretreatment process (S20) for defatting, etching, neutralizing, acid-treating, catalyzing, and activating the fiber material of the preparation process (S10); a nickel plating process (S30) for conducting electroless nickel plating on the fiber material of the pretreatment process (S20); a copper plating process (S40) for conducting electroless copper plating on the fiber material of the nickel plating process (S30); and a post-treatment process (S50) for dehydrating and drying the fiber material of the copper plating process (S40). Accordingly, the plating method is environmentally-friendly, can reduce production costs and processing time, and can improve overall productivity by minimizing environmental load materials while acquiring the compactness and flexibility of plating. [Reference numerals] (AA,BB,CC,DD) Water washing;(S10) Preparation process;(S20) Pretreatment process;(S30) Electroless nickel plating process;(S40) Electroless copper plating process;(S50) Posttreatment process
机译:本发明涉及一种向纤维施加导电性的镀覆方法,包括:注入纤维材料的制备工艺(S10);用于对制备过程中的纤维材料进行脱脂,蚀刻,中和,酸处理,催化和活化的预处理过程(S20);镀镍工艺(S30),用于在预处理工艺(S20)的纤维材料上进行化学镀镍;镀铜工艺(S40),用于在镀镍工艺(S30)的纤维材料上进行化学镀铜;后处理工序(S50),用于使镀铜工序(S40)的纤维材料脱水干燥。因此,该镀覆方法是环境友好的,可以减少生产成本和加工时间,并且可以通过在使镀覆的紧凑性和柔韧性获得最大的同时通过减少环境负荷材料来提高整体生产率。 [参考数字](AA,BB,CC,DD)水洗;(S10)制备工艺;(S20)预处理工艺;(S30)化学镀镍工艺;(S40)化学镀铜工艺;(S50)后处理工艺

著录项

  • 公开/公告号KR101420915B1

    专利类型

  • 公开/公告日2014-07-16

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20120049118

  • 发明设计人 권만천;

    申请日2012-05-09

  • 分类号D06M11/42;D06M11/83;D06M11/38;

  • 国家 KR

  • 入库时间 2022-08-21 15:40:29

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