首页> 外国专利> Optoelectronic device e.g. LED device has beam shaping element that is coupled to semiconductor chip, and through which portion of light emitted from semiconductor chip during operation of electromagnetic radiation is passed

Optoelectronic device e.g. LED device has beam shaping element that is coupled to semiconductor chip, and through which portion of light emitted from semiconductor chip during operation of electromagnetic radiation is passed

机译:光电装置LED器件具有光束整形元件,该光束整形元件耦合到半导体芯片,并且在电磁辐射操作期间从半导体芯片发射的光的一部分穿过该光束整形元件。

摘要

The optoelectronic device has semiconductor chip (101) that is provided for generating electromagnetic radiation. A portion of light emitted from semiconductor chip during the operation of electromagnetic radiation is passed through beam shaping element (102). The beam shaping element is coupled to semiconductor chip via coupling layer (103). The coupling layer is provided with matrix material (104) and nano-particles (105). The nanoparticles are made of material having greater refractive index than the matrix material. An independent claim is included for a method for manufacturing an optoelectronic device.
机译:该光电子器件具有半导体芯片(101),该半导体芯片被设置用于产生电磁辐射。在电磁辐射的操作期间从半导体芯片发射的光的一部分穿过束整形元件(102)。光束整形元件通过耦合层(103)耦合到半导体芯片。耦合层设置有基体材料(104)和纳米颗粒(105)。纳米颗粒由具有比基质材料更大的折射率的材料制成。包括用于制造光电器件的方法的独立权利要求。

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