Lead frame for lighting device e.g. LED module, has fitting station for semiconductor light source that is arranged adjacent to contact surface of conductive paths that are non-destructive pivotable towards connecting portions

摘要

The lead frame (11) has several conductive paths (15,17) whose end is connected with a contact surface (13) for a semiconductor light source (14) that is connected with a connecting portion of conductive paths. A fitting station (16) for semiconductor light source is arranged adjacent to contact surface of conductive paths. The contact surfaces of the conductive paths are non-destructive pivotable towards the connecting portions. An independent claim is included for a method for manufacturing lead frame.