首页> 外国专利> Joining electrically conductive joining partners for transmitting high electrical currents, comprises e.g. subjecting contact area of joining partners to surface treatment, contacting parts to be joined, and applying compressive force

Joining electrically conductive joining partners for transmitting high electrical currents, comprises e.g. subjecting contact area of joining partners to surface treatment, contacting parts to be joined, and applying compressive force

机译:用于传输高电流的导电连接伙伴的连接包括例如对连接伙伴的接触区域进行表面处理,接触要连接的零件并施加压缩力

摘要

Joining electrically conductive joining partners for transmitting high electrical currents, comprises (i) subjecting a contact area of the first joining partner (1) and second joining partner (2) to a surface treatment, and forming a surface structure with elevations and depressions/valleys, (ii) homogeneously distributing an adhesively acting polymer or polymer mixture, in electrically conductive particles, and coating on surface in the joining region of one of the parts to be joined, and (iii) immediately contacting two parts to be joined, and (iv) applying a compressive force. Joining electrically conductive joining partners for transmitting high electrical currents, comprises (i) subjecting a contact area of the first joining partner (1) and second joining partner (2) in a respective joining region, to a surface treatment, to remove impurities and/or external layers, and forming a surface structure with elevations and depressions/valleys in the same or a further process step, (ii) homogeneously distributing an adhesively acting polymer or polymer mixture, in electrically conductive particles in a proportion above the percolation threshold, in dispersed form and coating on at least one surface in the joining region of one of the parts to be joined, and (iii) immediately contacting two parts to be joined with each other, at least in the joining region, and (iv) applying a compressive force, with which the joining partners are clamped against each other, at least for the duration of chemical curing (polycondensation, polyaddition, or polymerization) or the physical setting of the polymeric components of the adhesive system formed with the polymer or polymer mixture and the particles such that a plastic deformation of projections is formed, which leads to the formation of electrically conductive micro-contact (4) between the joining partners in the joint area. An electrical connection resistance of an electrically conductive connection is few mu ~o below the specific electrical resistance of the adhesive system and is stable at 200[deg] C depending on the used adhesive system.
机译:接合用于传输高电流的导电接合对,包括:(i)对第一接合对(1)和第二接合对(2)的接触区域进行表面处理,并形成具有凸起和凹陷/谷的表面结构(ii)在导电颗粒中均匀地分配具有粘合作用的聚合物或聚合物混合物,并在要连接的零件之一的连接区域的表面上涂覆涂层,和(iii)立即接触要连接的两个零件,并且( iv)施加压力。用于导电的用于传递大电流的接合对的接合包括:(i)对第一接合对(1)和第二接合对(2)在各自的接合区域中的接触区域进行表面处理,以去除杂质和/或外层,并在同一步骤或进一步的工艺步骤中形成带有凸起和凹陷/谷的表面结构,(ii)将具有粘合作用的聚合物或聚合物混合物均匀地分布在导电颗粒中,其比例高于渗透阈值,在要连接的零件之一的连接区域中的至少一个表面上分散并涂覆涂层,以及(iii)至少在连接区域中立即使要连接的两个零件彼此接触,并且(iv)施加至少在化学固化(缩聚,加聚或聚合)或物理过程中将连接伙伴彼此夹紧的压缩力对由聚合物或聚合物混合物和颗粒形成的粘合剂体系的聚合物组分进行物理固化,从而形成突起的塑性变形,这导致在连接伙伴之间形成导电微接触(4)关节区域。导电连接的电连接电阻比粘合剂体系的比电阻低几微米,并且取决于所用的粘合剂体系在200℃下是稳定的。

著录项

  • 公开/公告号DE102013009234A1

    专利类型

  • 公开/公告日2013-12-05

    原文格式PDF

  • 申请/专利权人 TECHNISCHE UNIVERSITAET DRESDEN;

    申请/专利号DE20131009234

  • 发明设计人 SCHLEGEL STEPHAN;LANGER MAURICE;

    申请日2013-05-28

  • 分类号C09J5/02;C09J9/02;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:23

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