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首页> 外文期刊>Trends in Ecology & Evolution >Joining of Contact Pins and Conductive Compounds via Injection Molding - Influence of the Flow Situation on the Electrical Contact Resistance
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Joining of Contact Pins and Conductive Compounds via Injection Molding - Influence of the Flow Situation on the Electrical Contact Resistance

机译:通过注射成型加入接触引脚和导电化合物 - 流动情况对电接触电阻的影响

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摘要

While a lot of research can be found in the field of bulk resistance of carbon filled polymers, comparatively few papers focus on contact resistance between compound and metal contacts. Due to that small number of researches that deal with contact resistances, studies of the influence of injection molding conditions and parameters on the contact resistance are also very rare. In contradiction to that, these influences on bulk resistance have been studied. The objective of this work was to investigate the electrical contact resistance of overmolded tinplated copper contacts after modifying flow situations and molding conditions by procedural and constructional methods in contact areas. Metal pins were overmolded with a polypropylene compound containing 45 vol.% graphite, utilising an insert injection molding process. To affect the flow situation at the contacts, several processing parameters, such as mold temperature and injection speed, were modified. In addition, the contact alignment related to melt flow direction was varied. Electrical properties were studied and related to macroscopic and microscopic connection properties and flow situations in contact regions. It was found that the contact resistance is a significant factor while examining electrical resistances of overmolded samples. Furthermore, it was shown that the various flow situations had an essential impact on contact resistances. Weld lines at the position of the contact caused a decreased contact resistance. The correlation of the weld line effect, the filler orientation and contact resistance were successfully investigated by l-CT. Regarding processing parameters, it was observed that a high mold temperature of 120 degrees C increased not only bulk conductivity, but also had a positive impact on contact conductivity. Macroscopic and microscopic connection mechanisms of contact surfaces were interpreted and connected to the experimental observations.
机译:虽然在碳填充聚合物的散装电阻领域中可以发现大量研究,但相对较少的纸张侧重于化合物和金属触点之间的接触电阻。由于对接触电阻的研究数量的研究,研究对接触电阻的注塑条件和参数的影响也非常罕见。据矛盾,已经研究了这些对散热性的影响。这项工作的目的是研究通过在接触区域中通过程序和结构方法改变流量情况和模塑条件后,通过程序和结构方法在改变流动情况和模塑条件之后,研究过倍铜触点的电接触电阻。用含有45体积%石墨的聚丙烯化合物包覆成型金属销,利用插入注塑方法。为了影响触点处的流动情况,修改了几种处理参数,例如模具温度和注射速度。另外,改变了与熔体流动方向有关的接触对准。研究了电性能并与宏观和微观连接特性和接触区域中的流动情况相关。发现接触电阻是在检查包覆成型样品的电阻的同时是一个重要因素。此外,显示各种流动情况对接触电阻具有必要的影响。焊接线在接触位置导致接触电阻降低。通过L-CT成功地研究了焊接线效应,填料取向和接触电阻的相关性。关于处理参数,观察到120℃的高模压温度不仅增加了散装电导率,而且对接触电导率产生正影响。接触表面的宏观和微观连接机制被解释并连接到实验观察。

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