A method of embedding a CPU / GPU / LOGIC chip in a package-on-package substrate

摘要

Embodiments of the invention provide an IC system in which low power chips can be placed in close proximity to high power chips without suffering the effects of overheating. In one embodiment, the IC system may include a first substrate, a high performance chip embedded in the first substrate, a second substrate disposed on one side of the first substrate, the first substrate and the second substrate in electrical communication , and have a low power chip disposed on the second substrate. In various embodiments, a heat distribution layer is disposed adjacent to the high performance chip such that the heat generated by the high performance chip can be effectively dissipated into an underlying printed circuit board attached to the first substrate, thereby preventing heat transfer from the high performance chip to the low performance chip , Therefore, the life of the low power chip can be extended.