首页> 外国专利> Material for a dielectric substrate for the printed circuit and the antennas, the production of such a substrate carrying the means of interconnection between tracks and a dielectric substrate thus obtained.

Material for a dielectric substrate for the printed circuit and the antennas, the production of such a substrate carrying the means of interconnection between tracks and a dielectric substrate thus obtained.

机译:用于印刷电路和天线的电介质基片的材料,这样的基片的生产,其在轨道和电介质基片之间具有互连装置。

摘要

The dielectric substrate material comprises polyurethane foam that is made of: polyols comprising 50% of trimethylol-propane and isocyanate; and additives such as catalyst based amine, surfactants and bubbling agent, where the ratio of polyol or isocyanate is 0.1-1 in volume. Independent claims are included for: (1) a process for fabricating a dielectric substrate carrying a printed circuit and interconnection units between tracks of different level of a device such as an antenna; and (2) a dielectric substrate.
机译:介电衬底材料包括聚氨酯泡沫,该聚氨酯泡沫由以下材料制成:包含50%的三羟甲基丙烷和异氰酸酯的多元醇;和以及添加剂,例如基于催化剂的胺,表面活性剂和起泡剂,其中多元醇或异氰酸酯的体积比为0.1-1。包括以下独立权利要求:(1)一种制造介电基板的工艺,该介电基板在诸如天线的设备的不同水平的轨道之间承载印刷电路和互连单元;以及(2)电介质基板。

著录项

  • 公开/公告号FR2978443B1

    专利类型

  • 公开/公告日2014-05-09

    原文格式PDF

  • 申请/专利权人 THALES;

    申请/专利号FR20110002329

  • 申请日2011-07-26

  • 分类号C08G18/32;C08G101;H05K1/03;H05K3/42;H01L21/64;H01L23/14;

  • 国家 FR

  • 入库时间 2022-08-21 15:36:47

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号