首页> 外国专利> Method for manufacturing thin carrier of radio frequency device e.g. smart card, operating in high frequency field, involves heat treating contact pads of antenna to dry polymer ink, and connecting chip or electronic module to contact pads

Method for manufacturing thin carrier of radio frequency device e.g. smart card, operating in high frequency field, involves heat treating contact pads of antenna to dry polymer ink, and connecting chip or electronic module to contact pads

机译:用于制造射频装置的薄载体的方法,例如在高频场中工作的智能卡涉及对天线接触垫进行热处理以干燥聚合物墨水,并将芯片或电子模块连接到接触垫

摘要

The method involves printing a layer of conductive ink charged nanoparticles of thickness between 1 and 8 micrometer on two strands (111, 112) of an antenna (11), and heat treating the strands to sinter the nanoparticles. Contact pads are formed on the antenna by printing non-conductive polymer ink charged nanoparticles of thickness between 10 and 60 micrometer, to connect the strands of the antenna, where ends (12-15) of the strands are connected to the contact pads. The contact pads are heat treated to dry the polymer ink, and a chip or an electronic module is connected to the contact pads. Independent claims are also included for the following: (1) a thin carrier radio frequency device (2) a machine for manufacturing a thin carrier radio frequency device.
机译:该方法包括在天线(11)的两根股线(111、112)上印刷厚度为1至8微米的导电油墨带电纳米粒子层,并热处理股线以烧结纳米粒子。通过印刷厚度在10到60微米之间的不导电的聚合物墨水带电的纳米粒子,在天线上形成接触垫,以连接天线的股线,股线的末端(12-15)连接到触点板上。接触垫经过热处理以干燥聚合物墨水,并且芯片或电子模块连接到接触垫。还包括以下方面的独立权利要求:(1)薄载波射频设备(2)用于制造薄载波射频设备的机器。

著录项

  • 公开/公告号FR3002108A1

    专利类型

  • 公开/公告日2014-08-15

    原文格式PDF

  • 申请/专利权人 ASK;

    申请/专利号FR20130000320

  • 发明设计人 ILIEV PLAMEN;LUCEREAU THIERRY;

    申请日2013-02-14

  • 分类号H05K3/32;H01Q1/38;

  • 国家 FR

  • 入库时间 2022-08-21 15:36:28

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