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Method for manufacturing thin carrier of radio frequency device e.g. smart card, operating in high frequency field, involves heat treating contact pads of antenna to dry polymer ink, and connecting chip or electronic module to contact pads
Method for manufacturing thin carrier of radio frequency device e.g. smart card, operating in high frequency field, involves heat treating contact pads of antenna to dry polymer ink, and connecting chip or electronic module to contact pads
The method involves printing a layer of conductive ink charged nanoparticles of thickness between 1 and 8 micrometer on two strands (111, 112) of an antenna (11), and heat treating the strands to sinter the nanoparticles. Contact pads are formed on the antenna by printing non-conductive polymer ink charged nanoparticles of thickness between 10 and 60 micrometer, to connect the strands of the antenna, where ends (12-15) of the strands are connected to the contact pads. The contact pads are heat treated to dry the polymer ink, and a chip or an electronic module is connected to the contact pads. Independent claims are also included for the following: (1) a thin carrier radio frequency device (2) a machine for manufacturing a thin carrier radio frequency device.
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