首页> 外国专利> Electronic module for smart card, has metal ISO contacts and terminals of antenna connected to contact pads of microelectronic chip, where antenna and ISO contacts are located on same surface of module

Electronic module for smart card, has metal ISO contacts and terminals of antenna connected to contact pads of microelectronic chip, where antenna and ISO contacts are located on same surface of module

机译:用于智能卡的电子模块,具有金属ISO触点和连接到微电子芯片接触垫的天线端子,其中天线和ISO触点位于模块的同一表面上

摘要

The module has a dual communication interface with and without contact, and a substrate (8) which is metalized on one surface and includes a terminal of metal ISO contacts (19) for operation in contact with smart card reader contacts. An antenna (3) is provided with coils. The ISO contacts and terminals of the antenna are connected to contact pads of a microelectronic chip (2). The antenna and the ISO contacts are located on a same surface of the module. The ISO contacts and the terminals of the antenna are connected by conducting bridges. The substrate is a film. An independent claim is also included for a method for manufacturing an electronic module.
机译:该模块具有带和不带接触的双通信接口,以及在一个表面上金属化的基板(8),该基板(8)包括一个金属ISO触点(19)的端子,用于与智能卡读卡器触点接触。天线(3)设有线圈。天线的ISO触点和端子连接到微电子芯片(2)的接触垫。天线和ISO触点位于模块的同一表面上。 ISO触点和天线端子通过导电桥连接。基材是膜。还包括用于制造电子模块的方法的独立权利要求。

著录项

  • 公开/公告号FR2998395A1

    专利类型

  • 公开/公告日2014-05-23

    原文格式PDF

  • 申请/专利权人 SMART PACKAGING SOLUTIONS (SPS);

    申请/专利号FR20120003125

  • 发明设计人 CALVAS BERNARD;

    申请日2012-11-21

  • 分类号G06K19/077;

  • 国家 FR

  • 入库时间 2022-08-21 15:36:29

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