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A schottky barrier diode, a method of forming the diode and a design structure for the diode

机译:肖特基势垒二极管,该二极管的形成方法以及该二极管的设计结构

摘要

Disclosed are embodiments of a Schottky barrier diode. This diode can be formed in a semiconductor substrate having a doped region with a first conductivity type. A trench isolation structure can laterally surround a section of the doped region at the top surface of the substrate. A semiconductor layer can be positioned on the top surface of the substrate. This semiconductor layer can have a Schottky barrier portion over the defined section of the doped region and a guardring portion over the trench isolation structure laterally surrounding the Schottky barrier portion. The Schottky barrier portion can have the first conductivity type and the guarding portion can have a second conductivity type different from the first conductivity type. A metal silicide layer can overlie the semiconductor layer. Also disclosed are embodiments of a method of forming this Schottky barrier diode and of a design structure for the Schottky barrier diode.
机译:公开了肖特基势垒二极管的实施例。该二极管可以形成在具有第一导电类型的掺杂区域的半导体衬底中。沟槽隔离结构可以在衬底的顶表面处横向地围绕掺杂区的一部分。半导体层可以位于衬底的顶表面上。该半导体层可以在掺杂区的限定部分上具有肖特基势垒部分,并且在横向围绕肖特基势垒部分的沟槽隔离结构上具有保护环部分。肖特基势垒部分可以具有第一导电类型,并且保护部分可以具有与第一导电类型不同的第二导电类型。金属硅化物层可以覆盖半导体层。还公开了形成该肖特基势垒二极管的方法和肖特基势垒二极管的设计结构的实施例。

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