Radio frequency chip package structures with integrated antenna arrangements

摘要

A radio frequency chip package structure 100, or a method of forming such a package structure, comprises: an antenna 102 disposed on a side of a device 118, or die, where the antenna 102 includes an antenna substrate 104 with a vertical-through-via-connection 108 which is coupled to a further vertical-through-via-connection 116 disposed within the device 118, or die, and where the device 118, or die, is coupled with a package substrate 126. The radiating antenna element 106 may be perpendicular to the said vias. The antenna radiating element 106 or substrate 104 may comprise alternating layers of conductive and dielectric material. The device 118 may be coupled to the package substrate 126 by direct metal to metal bonding or by solder bumps. The package substrate 126 may comprise a multi-layer formation. Adjacent vias 116, 117 may be used for signal and ground connections to the antenna 102. The structure 100 may include stacked devices and/or shielding arrangements. The antenna substrate 104 may comprise at least one of a glass, an un-doped silicon and a liquid crystal polymer material.