HEAT RADIATION STRUCTURE AND HEAT RADIATION METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To achieve space-saving and a simplified structure of sheet-like heat sink for diffusing and radiating heat of an electronic component.;SOLUTION: Sheet-like heat sink 31 connected with an electronic component 7 includes folded shape sections 32 and 33 that are folded so as to be overlapped in plural. Specifically, the electronic component 7 is an imaging device mounted on a substrate 9 and the heat sink 31 is stuck onto the substrate 9 at an opposite surface of the imaging device 7. Therefore, generated heat by the imaging device 7 is radiated by the folded shape sections 32 and 33 of the sheet-like heat sink 31 at the back face side of the substrate 9.;COPYRIGHT: (C)2015,JPO&INPIT