SEMICONDUCTOR CIRCUIT, TRANSFER SOURCE SUBSTRATE, TRANSFER DESTINATION SUBSTRATE, SEMICONDUCTOR CIRCUIT DEVICE AND ELECTRO-OPTICAL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor circuit device capable of being connected to pads provided on a transfer source substrate and conductive wiring provided on a transfer destination substrate, and further to provide the semiconductor circuit device and an electro-optical device.;SOLUTION: A manufacturing method of a semiconductor circuit device comprises: a circuit forming step of forming a semiconductor circuit 120 having a plurality of bumps 125 on a transfer source substrate 100 via a peeling layer 110; a pressing step of causing a transfer destination substrate 300 formed with conductive wiring 310 and the semiconductor circuit 120 to face each other, pressing the transfer destination substrate 300 and the semiconductor circuit 120 via adhesive containing conductive particles and spreading the adhesive; an adhesive curing step of curing the adhesive; and a peeling step of peeling the semiconductor circuit 120 and the transfer source substrate 100 by the peeling layer 110. In the semiconductor circuit 120 formed in the circuit forming step, as viewed in a plan view, the plurality of bumps 125 is formed along a first end side of the semiconductor circuit 120, and at least one of power supply wiring 123 and ground wiring 124 is formed among the plurality of bumps 125 and the first end side.;COPYRIGHT: (C)2015,JPO&INPIT