THERMOSETTING CONDUCTIVE SILICONE COMPOSITION, CONDUCTIVE ADHESIVE COMPRISING THE COMPOSITION, CONDUCTIVE DIE-BONDING MATERIAL COMPRISING THE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF THE DIE-BONDING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting conductive silicone composition that gives a cured product having excellent adhesion strength and workability and having heat resistance, light fastness and crack resistance.SOLUTION: The thermosetting conductive silicone composition comprises: (A) an organopolysiloxane having at least one structure expressed by general formula (1) below in the molecule; (B) an organic peroxide; and (C) conductive particles. In the formula, m represents one of 0, 1, 2; Rrepresents a hydrogen atom, a phenyl group, or a halogenated phenyl group; Rrepresents a hydrogen atom or a methyl group; Rrepresents a substituted or unsubstituted monovalent organic group having 1 to 12 carbon atoms, and a plurality of Rmay be the same or different from each other; Zrepresents -R-, -R-O-, or -R(CH)Si-O- (where Rrepresents a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms and a plurality of Rmay be the same or different from each other); and Zrepresents an oxygen atom or a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms and a plurality of Zmay be the same or different from each other.