An optical semiconductor device comprising a heat curable conductive silicone composition, a conductive adhesive comprising the composition, a conductive die bond material comprising the composition, and a cured product of the die bond material.

摘要

A thermosetting conductive silicone composition comprises an organopolysiloxane having at least one structure represented by the following formula (1), wherein m is either of 0, 1 or 2; R1 represents a hydrogen atom, a phenyl group or a halogenated phenyl group; R2 represents a hydrogen atom or methyl group; R3s may be the same or different from each other and each represents a substituted or unsubstituted monovalent organic group having 1 to 12 carbon atoms; Z1 represents either of R4, R4O or R4(CH3)2SiO where R4s may be the same or different from each other and each represents a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms; and Z2s represent an oxygen atom or a substituted or unsubstituted divalent organic group having 1 to 10 carbon atoms which may be the same or different from each other; an organic peroxide; and conductive particles.