HEAT-CURABLE CONDUCTIVE SILICONE COMPOSITION, CONDUCTIVE ADHESIVE COMPRISING THE COMPOSITION, CONDUCTIVE DIE-BONDING MATERIAL COMPRISING THE COMPOSITION, AND OPTICAL SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF THE DIE-BONDING MATERIAL

摘要

The purpose of the present invention is to provide a heat-curable conductive silicone composition which has an outstanding adhesive strength and workability, and to endow a cured product with thermal resistance, light resistance, and crack resistance. For such, provided is a heat-curable conductive silicone composition comprising the following: (A) organopolysiloxane containing at least one of the structures marked by the general formula (1) in molecules, [Chemical formula 1] ] [In chemical formula, m is one of 0, 1, 2, R^1 refers to hydrogen atom, phenyl or phenyl halide, R^2 refers to hydrogen atom or methyl, R^3 refers to monovalent organic group of carbon atoms 1 to 12 that can be substituted or unsubstituted, and identical or different, Z^1 is one of -R^4-, -R^4-O-, -R^4(CH_3)_2Si-O-(R^4 refers to divalent organic group of carbon atoms 1 to 10 that may be substituted or unsubstituted, and identical or different), Z^2 is an oxygen atom, or divalent organic group of carbon atoms 1 to 10 that may be substituted or unsubstituted, and identical or different.]; (B) organic peroxide; (C) a heat-curable conductive silicone composition containing a conductive particle.