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TRANSLUCENT SILVER ALLOY FILM, AND SPUTTERING TARGET TRANSLUCENT SILVER ALLOY FILM FORMATION

机译:半透明银合金膜和溅射靶半透明银合金膜的形成

摘要

PROBLEM TO BE SOLVED: To provide: a translucent Ag alloy film which has superior smoothness, heat resistance, and resistance against sulfurizing, and good conductivity and permeability; and a sputtering target for translucent Ag alloy film formation which is adequate for growing such a translucent Ag alloy film.SOLUTION: A translucent Ag alloy film includes any one of In and Sn or both of them by 0.1-1.5 at% in total, and Sb by over 0.010 to 2.0 at% with the balance consisting of Ag and inevitable impurities. The translucent Ag alloy film has a thickness of 20 nm or less, and a transmittance of 30% more at a wavelength of 550 nm.
机译:要解决的问题:提供:一种半透明的银合金膜,该膜具有优异的光滑度,耐热性和抗硫化性,以及良好的导电性和渗透性;解决方案:半透明Ag合金膜包含In和Sn中的任一种或两者的总量为0.1-1.5at%,并且所述半透明Ag合金膜的溅射靶适于生长这种半透明Ag合金膜。 Sb超过0.010至2.0 at%,其余部分由Ag和不可避免的杂质组成。半透明的Ag合金膜的厚度为20nm或更小,并且在550nm的波长下的透射率为30%以上。

著录项

  • 公开/公告号JP2015035419A

    专利类型

  • 公开/公告日2015-02-19

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20140134571

  • 申请日2014-06-30

  • 分类号H05B33/28;H01L51/50;G02B5/22;G09F9/30;G06F3/041;

  • 国家 JP

  • 入库时间 2022-08-21 15:33:06

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