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MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT

机译:掺入多层陶瓷电子组件的多层陶瓷电子元件和印刷电路板

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component for incorporating board and a printed circuit board incorporating the multilayer ceramic electronic component.SOLUTION: In a multilayer ceramic electronic component for incorporating a board, a first external electrode includes a first base electrode electrically connected to an internal electrode, a first intermediate layer consisting of nickel (Ni) formed on the first base electrode, and a first terminal electrode formed on the first intermediate layer; a second external electrode includes a second base electrode electrically connected to a second internal electrode, a second intermediate layer consisting of nickel (Ni) formed on the second base electrode, and a second terminal electrode formed on the second intermediate layer; first and second base electrodes include a first conductive metal and a glass; and first and second terminal electrodes consist of a second conductive metal.
机译:解决的问题:提供用于结合板的多层陶瓷电子部件和结合该多层陶瓷电子部件的印刷电路板。解决方案:在用于结合板的多层陶瓷电子部件中,第一外部电极包括电学上的第一基础电极。连接到内部电极,第一中间层由形成在第一基础电极上的镍(Ni)组成,第一端子电极形成在第一中间层上;第二外部电极包括与第二内部电极电连接的第二基础电极,在第二基础电极上形成的由镍(Ni)构成的第二中间层,以及在第二中间层上形成的第二端子电极。第一和第二基极包括第一导电金属和玻璃。第一和第二端子电极由第二导电金属组成。

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