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MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT
MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT
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机译:掺入多层陶瓷电子组件的多层陶瓷电子元件和印刷电路板
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摘要
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component for incorporating board and a printed circuit board incorporating the multilayer ceramic electronic component.SOLUTION: In a multilayer ceramic electronic component for incorporating a board, a first external electrode includes a first base electrode electrically connected to an internal electrode, a first intermediate layer consisting of nickel (Ni) formed on the first base electrode, and a first terminal electrode formed on the first intermediate layer; a second external electrode includes a second base electrode electrically connected to a second internal electrode, a second intermediate layer consisting of nickel (Ni) formed on the second base electrode, and a second terminal electrode formed on the second intermediate layer; first and second base electrodes include a first conductive metal and a glass; and first and second terminal electrodes consist of a second conductive metal.
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