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MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT
MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR INCORPORATING BOARD AND PRINTED CIRCUIT BOARD INCORPORATING MULTILAYER CERAMIC ELECTRONIC COMPONENT
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机译:掺入多层陶瓷电子组件的多层陶瓷电子元件和印刷电路板
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摘要
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component for incorporating board and a printed circuit board incorporating the multilayer ceramic electronic component.SOLUTION: According to the present invention, a multilayer ceramic electronic component comprises: a ceramic body which includes a dielectric layer, and first and second main surfaces facing each other, first and second side surfaces facing each other and first and second end surfaces facing each other; a first internal electrode formed inside of the ceramic body and having first and second lead-out parts exposed to first and second side surfaces of the ceramic body and a second internal electrode exposed to first and second side surfaces of the ceramic body and having third and forth lead-out parts respectively arranged at a certain distance apart from first and second lead-out parts; and a first polarity external electrode formed so as to extend from both end surfaces of the ceramic body to first and second main surfaces and connected to first and second lead-out parts of the first internal electrode, and a second polarity external electrode connected to third and fourth lead-out parts of the second internal electrode.
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