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Overlay target with orthogonal lower layer dummy fill

机译:具有正交下层虚拟填充的覆盖目标

摘要

The present disclosure is directed to designing and using overlay targets having orthogonal lower layer dummy fills. The overlay target includes one or more segmented overlay pattern elements that form at least one overlay target structure. The overlay target further includes one or more inert pattern elements that form at least one dummy fill target structure. Each of the one or more inert pattern elements includes a dummy fill segmented along an axis orthogonal to the segmentation axis of at least one proximally disposed overlay pattern element. Each of the target structures or layers can be formed from separate process layers disposed sequentially on a substrate, such as a silicon wafer. The overlay and dummy fill target structure can be two or four-fold symmetric.
机译:本公开针对设计和使用具有正交的下层虚拟填充物的覆盖目标。覆盖目标包括形成至少一个覆盖目标结构的一个或多个分段的覆盖图案元素。覆盖靶还包括形成至少一个伪填充靶结构的一个或多个惰性图案元素。一个或多个惰性图案元件中的每一个包括虚拟填充物,该虚拟填充物沿着与至少一个近侧布置的覆盖图案元件的分割轴正交的轴分割。每个目标结构或层可以由顺序地设置在诸如硅晶片的衬底上的单独的处理层形成。覆盖和虚拟填充目标结构可以是两个或四个对称的。

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