additives for producing copper electrodeposit with a low oxygen content

摘要

copper electroplating bath for the production of copper electrodeposit is described. Copper electroplating bath comprises (a) a soluble copper salt, an electrolyte containing a (b) 1 or more acids, and a grain refining additive which contains (c) an alkyl diamine, an aryl diamines, or alkylaryl diamines including. Copper electroplating baths may be used to produce the copper electrodeposit with a low oxygen content.BACKGROUND