THERMOSETTING TYPE RESIN COMPOSITION FOR ADHESIVELY BONDING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting type resin composition for adhesively bonding a semiconductor that has low stress, good adhesive strength when heated after moisture absorption and good curability even in the atmosphere and to provide a semiconductor device using the thermosetting type resin composition for adhesively bonding a semiconductor that is excellent in solder reflow resistance.;SOLUTION: The thermosetting type resin composition for adhesively bonding a semiconductor comprises as essential components (A) a bismaleimide resin which is liquid at an ordinary temperature and has an aliphatic hydrocarbon group in the main chain, (B) an allylated epoxy resin which is a polymer of an allylated bisphenol and an epichlorohydrin, (C) a curing agent, and (D) a filler and has a mass ratio (A)/(B) of the component (A) to the component (B) of 50/50 to 95/5. The semiconductor device is produced by using the thermosetting type resin composition.;COPYRIGHT: (C)2015,JPO&INPIT