Wafer scale packaging die with an offset rewiring layer capture pad

摘要

An RDL capture pad (41) having an RDL pad central axis RR and an RDL pad outer peripheral end (49) disposed around the RDL capture pad central axis RR, and an under bump metal (on the RDL capture pad) A wafer scale packaging (WSP) die having a redistribution layer (RDL) with UBM) pads (60). The UBM pad has a UBM pad central axis UU and a UBM pad outer peripheral end (67) disposed around the UBM pad central axis UU. The UBM pad central axis UU is offset in the horizontal direction from the RDL pad central axis RR.