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Film forming method and the film-forming apparatus of amorphous carbon, silicon oxide mixed film

机译:非晶碳,氧化硅混合膜的成膜方法及成膜装置

摘要

PROBLEM TO BE SOLVED: To provide a film deposition method for uniformly and quickly depositing a mixed film of amorphous carbon and silicon oxide which has both characteristics of amorphous carbon and silicon oxide.;SOLUTION: Mixed gas G0 containing raw material gas is supplied between a holding electrode 1 and an electrode body 10 having an application electrode 2 which are arranged opposite to each other, and the AC voltage is applied to the application electrode 2 while generating the DC bias voltage between the electrode body 10 and the holding electrode 1 as necessary under the atmospheric state. Thus, glow discharge plasma is generated between a film-deposited body W held by the holding electrode 1 and the electrode body 10, and an amorphous carbon-silicon oxide mixed film is deposited on the film-deposited body W. Raw material gas contains hydrocarbon gas, organic silane gas and oxygen source gas. In the raw material gas, the mixture ratio of organic silane gas to oxygen source gas is 99.9-0.1 to 0.1-99.9, and the mixture ratio of hydrocarbon gas to organic silane gas+oxygen source gas is 1:99 to 99:1.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种均匀且快速地沉积兼具非晶碳和氧化硅特性的非晶碳和氧化硅混合膜的成膜方法。保持电极1和具有施加电极2的电极体10彼此相对地布置,并且在必要时在电极体10和保持电极1之间产生DC偏置电压的同时向施加电极2施加AC电压。在大气状态下。因此,在由保持电极1保持的膜沉积体W与电极体10之间产生辉光放电等离子体,并且在膜沉积体W上沉积无定形碳-氧化硅混合膜。原料气体包含烃气体,有机硅烷气体和氧气源气体。在原料气体中,有机硅烷气体与氧气源气体的混合比为99.9-0.1至0.1-99.9,烃气体与有机硅烷气体+氧气源气体的混合比为1:99至99:1。 ;版权:(C)2012,JPO&INPIT

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