Chemical mechanical polishing pad and chemical mechanical polishing method using the same

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad capable of making compatible both the improvement of the flatness of a surface to be polished and the reduction of a polishing defect (scratch) in CMP, and a chemical mechanical polishing method using the pad.;SOLUTION: The chemical mechanical polishing pad includes a polishing layer formed of a composition containing 80-99 pts.mass of thermoplastic polyurethane and 1-20 pts.mass of a polymer compound with the water absorption of 3-3,000%.;COPYRIGHT: (C)2011,JPO&INPIT