首页> 外国专利> NOVEL MULTI-FUNCTIONAL SEMICONDUCTOR REFRIGERATING AND WARMING DUAL-PURPOSE BOX AND MANUFACTURING METHOD

NOVEL MULTI-FUNCTIONAL SEMICONDUCTOR REFRIGERATING AND WARMING DUAL-PURPOSE BOX AND MANUFACTURING METHOD

机译:新型多功能半导体制冷和保温双用途箱及其制造方法

摘要

A multi-functional semiconductor refrigerating and warming dual-purpose box includes a box body, a refrigerating and heating unit, a composite condenser unit, and a liquid delivering pump. The box body includes two independent rooms, a bottom machine room, an upper working room, and a lower working room. The refrigerating and heating unit includes an upper room semiconductor refrigerating and heating unit and a lower room semiconductor refrigerating and heating unit, the upper room semiconductor refrigerating and heating unit comprising an external heat exchanger of the upper room, a first semiconductor chilling plate, and an internal heat exchanger of the upper room. The composite condenser unit and the liquid delivering pump are connected to the external heat exchanger of the upper room and the external heat exchanger of the lower room through pipes. A manufacturing method of a multi-functional semiconductor refrigerating and warming dual-purpose box is also provided.
机译:多功能半导体制冷保温两用箱,包括箱体,制冷加热单元,复合冷凝器单元和输液泵。箱体包括两个独立的房间,一个下机房,一个上工作室和一个下工作室。所述制冷加热单元包括:上室半导体制冷和加热单元和下室半导体制冷和加热单元,所述上室半导体制冷和加热单元包括所述上室的外部热交换器,第一半导体冷却板和加热室。上层房间的内部热交换器。复合冷凝器单元和液体输送泵通过管道连接到上部房间的外部热交换器和下部房间的外部热交换器。还提供了一种多功能半导体制冷保温两用箱的制造方法。

著录项

  • 公开/公告号US2015303124A1

    专利类型

  • 公开/公告日2015-10-22

    原文格式PDF

  • 申请/专利权人 WANHUI LIU;MAOXIANG SHEN;

    申请/专利号US201314440547

  • 发明设计人 WANHUI LIU;

    申请日2013-11-04

  • 分类号H01L23/34;B23P15/26;

  • 国家 US

  • 入库时间 2022-08-21 15:26:57

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