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THERMAL CONDUCTOR WITH ULTRA-THIN FLAT WICK STRUCTURE

机译:超薄扁平灯芯结构的热导体

摘要

A thermal conductor with an ultra-thin flat wick structure (2) includes a hollow shell (1) having a flat shape, and a wick structure (2) disposed in the shell (1) and contacted with an inner wall (100) of the shell (1), wherein the wick structure (2) is a thin planar body having a plane (20) and a pressing surface (21) opposite to the plane (20), wherein the plane (20) is attached to the inner wall (100) of the shell (1), wherein a plurality of elongated concave surfaces (210) are spacedly arranged on the pressing surface (21) such that a steam channel (101) is formed in the shell (1) via each of the concave surfaces (210) and an elongated wick structure connection (200) is formed between each concave surface (210) and the plane (20).
机译:具有超薄扁平芯吸结构( 2 )的导热体包括具有扁平形状的中空壳( 1 )和芯吸结构( 2 < / B>)放置在外壳( 1 )中并与外壳( 1 )的内壁( 100 )接触,其中灯芯结构( 2 )是具有平面( 20 )和与该平面(< B> 20 ),其中平面( 20 )连接到壳体( 1 )的内壁( 100 ) ),其中多个细长凹面( 210 )间隔排列在压紧表面( 21 )上,从而形成蒸汽通道( 101 )通过每个凹面( 210 )在壳( 1 )中形成,并形成细长的灯芯结构连接( 200 )在每个凹面( 210 )和平面( 20 )之间。

著录项

  • 公开/公告号US2015101783A1

    专利类型

  • 公开/公告日2015-04-16

    原文格式PDF

  • 申请/专利权人 HAO PAI;

    申请/专利号US201314054104

  • 发明设计人 HAO PAI;

    申请日2013-10-15

  • 分类号F28D15/04;

  • 国家 US

  • 入库时间 2022-08-21 15:26:05

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