首页> 外国专利> FABRICATING FIELD EFFECT TRANSISTOR(S) WITH STRESSED CHANNEL REGION(S) AND LOW-RESISTANCE SOURCE/DRAIN REGIONS

FABRICATING FIELD EFFECT TRANSISTOR(S) WITH STRESSED CHANNEL REGION(S) AND LOW-RESISTANCE SOURCE/DRAIN REGIONS

机译:应力沟道区和低电阻源/漏区的场效应晶体管的制造

摘要

Methods of fabricating field effect transistors having a source region and a drain region separated by a channel region are provided which include: using a single mask step in forming a first portion(s) and a second portion(s) of at least one of the source region or the drain region, the first portion(s) including a first material selected and configured to facilitate the first portion(s) stressing the channel region, and the second portion(s) including a second material selected and configured to facilitate the second portion(s) having a lower electrical resistance than the first portion(s). One embodiment includes: providing the first material with a crystal lattice structure; and forming the second material by disposing another material interstitially with respect to the crystal lattice structure. Another embodiment includes forming the first portion and the second portion within at least one of a source cavity or a drain cavity of the semiconductor substrate.
机译:提供了一种制造具有被沟道区分开的源极区和漏极区的场效应晶体管的方法,该方法包括:使用单个掩模步骤来形成所述沟道区中的至少一个的第一部分和第二部分。源极区或漏极区,第一部分包括被选择和配置成有助于第一部分向沟道区施加应力的第一材料,第二部分包括被选择和配置成有利于沟道材料的第二材料。第二部分具有比第一部分低的电阻。一个实施例包括:为第一材料提供晶格结构;通过相对于晶格结构间隙地布置另一种材料来形成第二材料。另一个实施例包括在半导体衬底的源腔或漏腔中的至少一个内形成第一部分和第二部分。

著录项

  • 公开/公告号US2015311120A1

    专利类型

  • 公开/公告日2015-10-29

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201414262882

  • 发明设计人 SHASHIDHAR SHREESHAIL SHINTRI;MIN-HWA CHI;

    申请日2014-04-28

  • 分类号H01L21/8234;H01L21/324;H01L21/02;H01L29/78;H01L29/267;

  • 国家 US

  • 入库时间 2022-08-21 15:25:58

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