首页> 外国专利> CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING THE SAME, HIGH THERMAL CONDUCTIVE RESIN COMPOSITION, AND HIGH THERMAL CONDUCTIVE LAMINATED SUBSTRATE

CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING THE SAME, HIGH THERMAL CONDUCTIVE RESIN COMPOSITION, AND HIGH THERMAL CONDUCTIVE LAMINATED SUBSTRATE

机译:固化性树脂组合物,其制造方法,高导热性树脂组合物和高导热性层压基材

摘要

A curable resin composition including aluminum nitride particles, an epoxy resin, a curing agent and an acidic phosphate ester represented by the following formula (1):; embedded image ;(In the formula (1),R1 represents a C4-20 hydrocarbyl group;R2 represents a C1-20 saturated hydrocarbylene group;R3 represents a C2-3 saturated hydrocarbylene group;R4 represents a C1-8 hydrocarbylene group;k represents an integer of 0 to 20;l represents an integer of 0 to 20;m represents an integer of 0 to 20; andn represents an integer of 1 or 2, whereinwhere a plurality of Ri (i is 1 to 4) exist, the plurality of Ri may be the same as or different from each other;k —COR2O— groups, l —R3O— groups, and m —COR4COO— groups may be in any order; andwhere n is 2, two R1O(COR2O)k(R3O)l(COR4COO)m groups may be the same as or different from each other.)
机译:一种可固化树脂组合物,包括氮化铝颗粒,环氧树脂,固化剂和下式(1)表示的酸性磷酸酯: “嵌入式图像” ;(在公式(1)中, R 1 表示一个C4-20烃基; R 2 代表C1-20饱和亚烃基; R 3 代表C2-3饱和亚烃基; R 4 表示一个C1-8亚烃基; k代表0到20的整数; l代表0到20的整数; m表示0到20的整数;和 n表示1或2的整数,其中 其中存在多个R i (i为1到4),多个R i 可以彼此相同或不同; k -COR 2 O-组,l -R 3 O-组和m -COR 4 COO-组可以按任何顺序排列;和 其中n为2,两个R 1 O(COR 2 O) k (R 3 O) l (COR 4 COO) m 个组可能是彼此相同或不同。)

著录项

  • 公开/公告号US2015079401A1

    专利类型

  • 公开/公告日2015-03-19

    原文格式PDF

  • 申请/专利权人 TOKUYAMA CORPORATION;

    申请/专利号US201314387494

  • 发明设计人 HIDEKI OHNO;

    申请日2013-03-28

  • 分类号C09K5/08;C09J5/00;

  • 国家 US

  • 入库时间 2022-08-21 15:25:09

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