首页> 外国专利> HIGH-PERFORMANCE REVERSE-CONDUCTION FIELD-STOP (RCFS) INSULATED GATE BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

HIGH-PERFORMANCE REVERSE-CONDUCTION FIELD-STOP (RCFS) INSULATED GATE BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME

机译:高性能反向传导场截止绝缘栅双极晶体管及其制造方法

摘要

A high-performance reverse-conduction field-stop (RCFS) insulated gate bipolar transistor (IGBT) includes a first conductive type substrate, a plurality of trenches defined on a bottom face of the substrate, a plurality of first conductive type doping regions formed on bottom face of the trenches, a second conductive type doping region formed on bottom face of the substrate, and a first conductive type field stop doping region formed in the substrate and separated from the bottom face of the substrate by a field stop depth, where the field stop depth is larger than a depth of the trench. Due to a separation between the first conductive type doping regions and the second conductive type doping region, Zener diode can be prevented from forming on bottom side of the substrate and the performance of IGBT can be accordingly enhanced.
机译:高性能反向导电场截止(RCFS)绝缘栅双极晶体管(IGBT)包括第一导电类型的基板,在基板底面上限定的多个沟槽,在其上形成的多个第一导电类型的掺杂区沟槽的底面,形成在衬底的底面上的第二导电类型的掺杂区域,以及形成在衬底中并与衬底的底面相隔场停止深度的第一导电类型的场终止掺杂区域,其中场停止深度大于沟槽的深度。由于第一导电类型掺杂区和第二导电类型掺杂区之间的分隔,可以防止齐纳二极管形成在基板的底侧上,并且因此可以提高IGBT的性能。

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