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ELEMENTAL SEMICONDUCTOR MATERIAL CONTACT FOR HIGH INDIUM CONTENT InGaN LIGHT EMITTING DIODES

机译:高铟含量InGaN发光二极管的元素半导体材料接触

摘要

A vertical stack including a p-doped GaN portion, a multi-quantum-well including indium gallium nitride layers, and an n-doped transparent conductive material portion is formed on an insulator substrate. A dielectric material liner is formed around the vertical stack, and is patterned to physically expose a surface of the p-doped GaN portion. A selective low temperature epitaxy process is employed to deposit a semiconductor material including at least one elemental semiconductor material on the physically exposed surfaces of the p-doped GaN portion, thereby forming an elemental semiconductor material portion. The selective low temperature epitaxy process can be performed at a temperature lower than 600° C., thereby limiting diffusion of materials within the multi-quantum well and avoiding segregation of indium within the multi-quantum well. The light-emitting diode can generate a radiation of a wide range including blue and green lights in the visible wavelength range.
机译:在绝缘体基板上形成包括p掺杂的GaN部分,包括氮化铟镓层的多量子阱和n掺杂的透明导电材料部分的垂直堆叠。在垂直堆叠周围形成电介质材料衬里,并对其进行构图以物理暴露p掺杂GaN部分的表面。采用选择性低温外延工艺在p掺杂的GaN部分的物理暴露的表面上沉积包括至少一种元素半导体材料的半导体材料,从而形成元素半导体材料部分。选择性低温外延工艺可以在低于600℃的温度下进行,从而限制了材料在多量子阱内的扩散,并避免了铟在多量子阱内的偏析。发光二极管可以产生宽范围的辐射,包括可见波长范围内的蓝色和绿色光。

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