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Multilayered printed circuit board, more particularly flame-resistant and/or smoke-suppressing multilayered printed circuit board

机译:多层印刷电路板,尤其是耐燃和/或抑烟的多层印刷电路板

摘要

In the case of a multilayered printed circuit board (20), more particularly a flame-resistant and/or smoke-suppressing multilayered printed circuit board, consisting of a plurality of interconnected layers (2, 3, 12, 13) composed of incombustible, conductive material and layers (1, 11) composed of non-conductive material, two layers (2, 3, 12) composed of a conductive material in each case being separated by at least one layer (1, 11) composed of a non-conductive material, it is provided that the printed circuit board (20) contains in its interior at least two layers (2, 3, 12) having a surface proportion of at least 50%, more particularly at last 70%, composed of the incombustible, conductive material, as a result of which a multilayered printed circuit board (20) having improved flame resistance and reduced smoke evolution can be made available.
机译:在多层印刷电路板( 20 )的情况下,更具体地说,是由多层互连层( 2,由不可燃的导电材料组成的3、12、13 )和由非导电材料组成的层( 1、11 ),两层( 2、3、12 1、11 )隔开由导电材料构成的B>),其中,印刷电路板( 20 )在其内部包含至少两层( 2、3、12 ),其表面比例至少为50%,尤其是至少为70%,由不可燃物组成,导电材料,其结果是,可以得到具有改善的阻燃性和减少的烟雾散发的多层印刷电路板( 20 )。

著录项

  • 公开/公告号US9161431B2

    专利类型

  • 公开/公告日2015-10-13

    原文格式PDF

  • 申请/专利权人 RONALD FROSCH;MANFRED RIEDLER;

    申请/专利号US201013381454

  • 发明设计人 RONALD FROSCH;MANFRED RIEDLER;

    申请日2010-06-25

  • 分类号H05K1/09;H05K1/03;H05K1/02;H05K3/34;

  • 国家 US

  • 入库时间 2022-08-21 15:23:11

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