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METHOD OF ELECTROPLATING WITH Sn-ALLOY AND APPARATUS OF ELECTROPLATING WITH Sn-ALLOY
METHOD OF ELECTROPLATING WITH Sn-ALLOY AND APPARATUS OF ELECTROPLATING WITH Sn-ALLOY
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机译:锡合金电镀的方法及锡合金电镀的装置
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摘要
To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.
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