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Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloy

机译:锡合金电镀的方法和锡合金电镀的设备

摘要

To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.
机译:本发明提供一种利用Sn合金进行电镀的方法,其中,解决了在进行Sn-Ag系合金等Sn合金电镀时,金属在阳极上的析出问题,能够使可溶性阳极化的问题。用过的。通过阴离子交换膜将镀槽的内部分为阴极单元和阳极单元。将包括Sn离子的镀液供应到阴极单元;向阳极电池供应酸溶液;通过给阴极电池中的待镀物体和阳极电池中的由Sn制成的阳极通电来进行电镀;并且,使用从Sn制成的负极中析出的包含Sn离子的酸性溶液,并随着镀覆的进行,作为用于阴极电池中的镀覆溶液的Sn离子的补充溶液。

著录项

  • 公开/公告号US9506163B2

    专利类型

  • 公开/公告日2016-11-29

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORPORATION;

    申请/专利号US201314375041

  • 发明设计人 TAKESHI HATTA;AKIHIRO MASUDA;

    申请日2013-02-12

  • 分类号C25D17/00;C25D3/60;C25D21/18;C25D17/02;C25D21/14;C25D3/56;

  • 国家 US

  • 入库时间 2022-08-21 13:41:22

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