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Power device and a reverse conducting power IGBT

机译:功率器件和反向导通功率IGBT

摘要

A semiconductor device is provided which includes a semiconductor body having a base region and a main horizontal surface, and a first electrode arranged on the main horizontal surface. The semiconductor body further includes a plurality of vertical trenches having gate electrodes in a vertical cross-section. A body region forms a first pn-junction with the base region and extends between two of the vertical trenches. A source region is in ohmic contact with the first electrode and arranged between the two vertical trenches. An anti-latch-up region is arranged between the two vertical trenches and in ohmic contact with the first electrode. The anti-latch-up region has a maximum doping concentration which is higher than a maximum doping concentration of the body region. An anode region forms a rectifying pn-junction with the base region only and adjoins a third one of the vertical trenches, and has ohmic contact with the first electrode.
机译:提供一种半导体器件,该半导体器件包括:具有基部区域和主水平表面的半导体本体;以及布置在主水平表面上的第一电极。半导体本体还包括多个垂直沟槽,所述多个垂直沟槽在垂直截面中具有栅电极。体区与基区形成第一pn结,并在两个垂直沟槽之间延伸。源极区与第一电极欧姆接触并且布置在两个垂直沟槽之间。在两个垂直沟槽之间并与第一电极欧姆接触地布置有防闩锁区域。抗闩锁​​区域具有最大掺杂浓度,该最大掺杂浓度高于主体区域的最大掺杂浓度。阳极区仅与基极区形成整流pn结,并邻接垂直沟槽中的第三个,并且与第一电极欧姆接触。

著录项

  • 公开/公告号US9082813B2

    专利类型

  • 公开/公告日2015-07-14

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AUSTRIA AG;

    申请/专利号US201313748172

  • 发明设计人 FRANK PFIRSCH;

    申请日2013-01-23

  • 分类号H01L29/78;H01L29/06;H01L29/10;H01L29/739;H01L29/08;

  • 国家 US

  • 入库时间 2022-08-21 15:20:50

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