首页> 外国专利> Method of adhering hard silicone resin, method of adhering substrate having fine structure, and preparation method of micro fluidic device utilizing adhesion method

Method of adhering hard silicone resin, method of adhering substrate having fine structure, and preparation method of micro fluidic device utilizing adhesion method

机译:硬质硅树脂的粘接方法,具有微细结构的基板的粘接方法以及利用粘接法的微流体装置的制备方法

摘要

A method for adhering a major substrate to which nano sized concave and convex structures are formed without damaging the concave and convex structures can be used in a production method of a microfluidic device including nano sized fluidic channels. The substrates may be adhered under heat free and adhesive agent free environment by exciting the substrate surface including hard silicone resin with atmospheric plasma or vacuum ultraviolet light, then juxtaposing and pressurizing the surface of the hard silicone resin substrate and glass substrate. The silicone rubber composition is applied on the contact face of the cover substrate and then the silicone rubber composition is cured to form the silicone rubber layer and then the ultraviolet light is exposed under the condition that the surface of the major substrate being formed with concave and convex structures is contacted closely to the silicone rubber layer of the cover substrate.
机译:在包括纳米级流体通道的微流体装置的生产方法中,可以使用用于粘附形成有纳米级凹凸结构而不会损坏凹凸结构的主基板的方法。通过用大气等离子体或真空紫外线激发包括硬硅树脂的基板表面,然后将硬硅树脂基板和玻璃基板的表面并置并加压,可以在无热和无粘合剂的环境下粘合基板。将硅橡胶组合物涂覆在覆盖基板的接触面上,然后将硅橡胶组合物固化以形成硅橡胶层,然后在主基板的表面形成凹形且凹陷的条件下使紫外线曝光。凸结构紧密接触覆盖基板的硅橡胶层。

著录项

  • 公开/公告号US8956494B2

    专利类型

  • 公开/公告日2015-02-17

    原文格式PDF

  • 申请/专利权人 TAKATOKI YAMAMOTO;

    申请/专利号US201113522507

  • 发明设计人 TAKATOKI YAMAMOTO;

    申请日2011-01-19

  • 分类号B29C65/14;B01L3/00;B29C59/14;B29C59/16;B29C65/48;B29C65/52;B29C65/82;B29C65/00;B81C3/00;B29C35/08;B29L31/00;

  • 国家 US

  • 入库时间 2022-08-21 15:20:08

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