METHOD FOR BONDING HARDENED SILICONE RESIN, METHOD FOR JOINING SUBSTRATE HAVING FINE STRUCTURE, AND METHOD FOR MANUFACTURING MICRO FLUID DEVICE USING THE METHOD FOR JOINING

摘要

The present invention provides a novel method for adhering a hard silicone resin. The present invention also provides a method of producing a microfluidic device having a nano-flow path using the method and the joining method for joining the main substrate and the cover substrate is formed concavo-convex structure of the nano-size without damaging the uneven structure. By pressing by overlapping the rigid surface of a substrate made of a silicon resin to the irradiation of the irradiation or vacuum ultraviolet light in the atmospheric pressure plasma excitation, and then the hard surface and the glass substrate and the like of the silicone resin substrate, to heat, adhesion by an adhesive-free the two substrates can. In addition, by curing it after coating the silicone rubber composition to the bonding surface of the cover substrate ultraviolet rays after forming the silicone rubber layer, in which close contact with the silicone rubber layer of the main surface of the substrate and the cover substrate concave-convex structure is formed in the state, from the main substrate side When the irradiation, a silicon oxide film is formed on the bonding interface, the both substrates are firmly adhered. ;